Semiconductor device

Details Semiconductor device Semiconductor device

2006-12-12

2006-12-12

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S773000, C257S784000

Reexamination Certificate

active

07148504

ABSTRACT:
One of aspects of the present invention is to provide a semiconductor device, which includes an insulating substrate, and a semiconductor chip mounted on the insulating substrate. The semiconductor chip has a chip electrode thereon. The semiconductor device also includes a first terminal electrically connected with the chip electrode through a first metal wire, and a second terminal electrically connected with the chip electrode through a second metal wire that is more likely to be disconnected than the first metal wire. A signal of disconnection of the second metal wire is output at the second terminal.

REFERENCES:
patent: 5804859 (1998-09-01), Takahashi et al.
patent: 2005/0236617 (2005-10-01), Yamada
patent: 8-195411 (1996-07-01), None

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