Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-06-27
2006-06-27
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000, C430S905000, C430S907000, C430S910000, C526S281000
Reexamination Certificate
active
07067231
ABSTRACT:
A polymer comprising recurring units having a partial structure of formula (1) wherein R1is a single bond or alkylene or fluoroalkylene, R2and R3are H or alkyl or fluoroalkyl, at least one of R2and R3contains at least one fluorine atom is used as a base resin to formulate a resist composition which has advantages including high transparency to radiation having a wavelength of up to 200 nm, substrate adhesion, developer affinity and dry etching resistance
REFERENCES:
patent: 3715342 (1973-02-01), Colomb et al.
patent: 4491628 (1985-01-01), Ito et al.
patent: 5310619 (1994-05-01), Crivello et al.
patent: 6746818 (2004-06-01), Kinsho et al.
patent: 6830870 (2004-12-01), Malik et al.
patent: 2003/0059710 (2003-03-01), Inoue
patent: 2003/0129527 (2003-07-01), Kudo et al.
patent: 63-27829 (1988-02-01), None
patent: 2-27660 (1990-06-01), None
patent: 9-73173 (1997-03-01), None
patent: 9-230595 (1997-09-01), None
patent: 10-10739 (1998-01-01), None
patent: WO-97/33198 (1997-09-01), None
patent: WO 2004096786 (2004-11-01), None
patent: WO 2005005404 (2005-01-01), None
Ito et al., “Polymer design for 157 nm chemically amplified resists”, Proceedings of SPIE, vol. 4345, pp. 273-284, (2001).
Kodama et al., “Synthesis of novel fluoropolymer for 157 nm photoresists by cyclo-polymerization”, Proceedings of SPIE, vol. 4690, pp. 76-83, (2002).
Endo Masayuki
Harada Yuji
Hatakeyama Jun
Kawai Yoshio
Kishimura Shinji
Central Glass Co. Ltd.
Chu John S.
Shin-Etsu Chemical Co. , Ltd.
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