Flip chip stack

Details Flip chip stack Flip chip stack

2006-11-07

2006-11-07

Tran, Long (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S777000, C257SE23085, C257SE25013, C438S109000

Reexamination Certificate

active

07132754

ABSTRACT:
A flip chip stack of integrated circuits for minimum volume packaging with interconnected chips attached to one or two sides of a flexible circuit board where stacking arrangements for two, five and six chips are disclosed.

REFERENCES:
patent: 5776797 (1998-07-01), Nicewarner et al.
Allan, R., SIP Raelly Packs it in, Electronic Design, Nov. 29, 2004, ED Online ID# 9175 accessed at http://www.elecdesign.com/Articles/ArticleID/9175/9175.html on Jan. 26, 06.
Riley, G.A., Tutorial 24: Gold Stud Bump Applications, accessed at http://www.flipchips.com/tutorial24.html on Jan. 26, 2006.

Affiliated with

Also associated with

Rating

Flip chip stack does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip chip stack, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip chip stack will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3658737