Lead frame design for increased chip pinout

Details Lead frame design for increased chip pinout Lead frame design for increased chip pinout

1998-04-02

2000-03-07

Fahmy, Wael

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257676, 257673, 257666, 257778, H01L 23495

Patent

active

060344237

ABSTRACT:
An integrated circuit (IC) module incorporates a modified lead frame having a die attach platform, a plurality of leads extending away from the die attach platform, and a plurality of bus bars surrounding the die attach platform. Multiple I/O pads on an IC chip mounted on the die attach platform requiring a common power supply voltage or communication signals are connected to a common bus bar, allowing a greater variety of signals to be provided from the fixed number of IC-PCB interconnections on the IC module. The bus bar design is readily incorporated into all IC module packaging techniques using conventional manufacturing processes. An embodiment of a lead frame for a lead frame BGA package also includes circular attachment pads at the ends of all leads in order to provide a circular area for mounting of solder balls to ensure consistent solder flow and uniform final solder ball profile without requiring circular vias.

REFERENCES:
patent: 5389817 (1995-02-01), Imamura et al.
patent: 5663593 (1997-09-01), Mostafazadeh et al.
patent: 5796589 (1998-08-01), Barrow

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