Wiring board, stacked wiring board and method of...

Details Wiring board, stacked wiring board and method of... Wiring board, stacked wiring board and method of...

2006-10-17

2006-10-17

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S779000, C257S780000, C257S781000, C438S612000, C438S613000

Reexamination Certificate

active

07122909

ABSTRACT:
A wiring board has a substrate and an interconnect pattern formed on the substrate. The interconnect pattern includes a plurality of lands. Each of the lands includes a base section and an additional section extending from the base section, the base section of each of the lands having the same shape. When a spiral curve is rotated around an origin and disposed to pass over the base section, the additional section is formed to extend from the base section of any one of the lands in a direction along the spiral curve.

REFERENCES:
patent: 3302157 (1967-01-01), Olson
patent: 6137064 (2000-10-01), Kiani et al.
patent: 6370032 (2002-04-01), DiStefano et al.
patent: 6613662 (2003-09-01), Wark et al.
patent: 2003/0022558 (2003-01-01), Imaoka
patent: A 2003-46212 (2003-02-01), None

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