Bonding of aluminum oxide components to silicons substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257466, 385 35, H01L 310232, H01L 3100, G02B 632

Patent

active

060344059

ABSTRACT:
The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.

REFERENCES:
patent: 3983284 (1976-09-01), Croset
patent: 5178319 (1993-01-01), Coucoulas
patent: 5194105 (1993-03-01), Nguyen
patent: 5559918 (1996-09-01), Furuyama et al.
patent: 5567981 (1996-10-01), Bhansali et al.
patent: 5784509 (1998-07-01), Yamane et al.
U.S. Patent Application Serial Number 60/009116 filed on Dec. 22, 1995 (Anigbo).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Bonding of aluminum oxide components to silicons substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Bonding of aluminum oxide components to silicons substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bonding of aluminum oxide components to silicons substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-365716

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.