High density flat cell mask ROM

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257391, 257401, 257510, 257639, H01L 2972

Patent

active

060344032

ABSTRACT:
A high-density flat cell mask ROM is disclosed. The mask ROM comprises: a semiconductor substrate having a plurality of trenches and each of the trenches is separated to keep a space with each other. A plurality of oxynitride layers is formed on all sidewall and bottom surfaces of those trenches. A plurality of n+-doped polysilicon layers is formed on the oxynitride layers. A n+ doped silicon layer serves as buried bit line formed in the semiconductor substrate and surrounding the trenches. Each of the doped silicon layers is spaced from the n+-doped polysilicon layers by the oxynitride layer. A plurality of thick oxide layers is formed on the n+ polysilicon layers. A plurality of thin oxide layers are formed on the semiconductor substrate and between those thick oxide layer, and each of thin oxide layers is contiguous with the thick oxide layers. A coding region is formed in the semiconductor substrate and abutting one of those thin oxide layers, and another n+-doped polysilicon layer formed on upper surfaces of those thick oxide layers, and those thin oxide layers.

REFERENCES:
patent: 5517047 (1996-05-01), Linn et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

High density flat cell mask ROM does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High density flat cell mask ROM, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density flat cell mask ROM will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-365700

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.