Method and apparatus to enable accurate wafer prediction

Details Method and apparatus to enable accurate wafer prediction Method and apparatus to enable accurate wafer prediction

2006-12-05

2006-12-05

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000

Reexamination Certificate

active

07144297

ABSTRACT:
A method for monitoring a processing tool in a semiconductor manufacturing facility includes selecting key hardware parameters for a virtual sensor system based on manufacturing data associated with a fabrication tool and collecting manufacturing data associated with the fabrication tool. The method further includes dynamically maintaining the virtual sensor system during the manufacture of a plurality of semiconductor products and using the virtual sensor system and the collected manufacturing data for predicting a condition of a semiconductor product after being processed by the fabrication tool.

REFERENCES:
patent: 6732007 (2004-05-01), Pasadyn et al.
patent: 6745086 (2004-06-01), Pasadyn et al.
patent: 6917849 (2005-07-01), Pasadyn et al.

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