Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2006-11-21
2006-11-21
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S341000, C257S672000, C361S772000, C361S813000
Reexamination Certificate
active
07138673
ABSTRACT:
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that a bottom surface of the semiconductor chip is in contact with the plate-like mount. The semiconductor package also includes at least one lead element having an outer portion arranged to be flush with the plate-like mount, and an inner portion deformed and shaped to overhang the semiconductor chip such that an inner end of the lead element is spaced apart from the top surface of the semiconductor chip. The semiconductor package further includes a bonding-wire element bonded at ends thereof to the electrode of the semiconductor chip and the inner end of the lead element, an enveloper sealing and encapsulating the plate-like mount, the semiconductor chip, the inner portion of the lead element, and the bonding-wire element.
REFERENCES:
patent: 5172214 (1992-12-01), Casto
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5767569 (1998-06-01), Ohta et al.
patent: 6043430 (2000-03-01), Chun
patent: 6242798 (2001-06-01), Cha et al.
patent: 6297544 (2001-10-01), Nakamura et al.
patent: 6307272 (2001-10-01), Takahashi et al.
patent: 2002/0070431 (2002-06-01), Misumi et al.
patent: 2003/0075785 (2003-04-01), Crowley et al.
patent: 2005/0121799 (2005-06-01), Uchida
patent: 52-127756 (1977-10-01), None
patent: 2714037 (1990-03-01), None
patent: 05-121615 (1993-05-01), None
patent: 08-255863 (1996-10-01), None
patent: 10-214933 (1998-08-01), None
patent: 11-166106 (1999-06-01), None
patent: 11-354702 (1999-12-01), None
patent: 2000049184 (2000-02-01), None
patent: 2000-114445 (2000-04-01), None
patent: 3240292 (2000-04-01), None
Chambliss Alonzo
NEC Electronics Corporation
Young & Thompson
LandOfFree
Semiconductor package having encapsulated chip attached to a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package having encapsulated chip attached to a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package having encapsulated chip attached to a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3644874