Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-11-14
2006-11-14
Sarkar, Asok Kumar (Department: 2891)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C324S755090, C324S765010, C257SE21522
Reexamination Certificate
active
07135345
ABSTRACT:
Improved methods and apparatus are provided for the handling and testing of semiconductor devices. One embodiment comprises a die carrier for one or more semiconductor dice having very fine pitch electrical I/O (input/output) elements. The semiconductor dice are temporarily attached to the die carrier in singulated form to enable testing the dice with conventional contact technology. The die carrier may include a flex circuit base substrate and a rigid support frame. Further embodiments comprise materials and methods for attaching the semiconductor dice to the die carrier and for providing a temporary electrical connection with the semiconductor dice during testing. Exemplary materials for providing the temporary electrical connection may comprise a conductive film or tape, a conductive or conductor-filled epoxy, resin or RTV adhesive-based materials, a water-soluble material impregnated with a conductive filler or non-reflowed solder paste.
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Cram Daniel P.
Hamren Steven L.
Micro)n Technology, Inc.
Sarkar Asok Kumar
TraskBritt
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