Micromechanical device and method for its production

Details Micromechanical device and method for its production Micromechanical device and method for its production

1999-04-01

2000-04-04

Dutton, Brian

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 53, 7351421, 7351429, 7351432, H01L 2100, G01P 1500

Patent

active

060460679

ABSTRACT:
A micromechanical device contains, on a carrier or substrate (1, 10), a micromechanical region which is covered on the chip by a planar covering (D) arranged on the carrier. A method for the production of a micromechanical device of this type provides that a body is formed in which a first insulating layer (2, 11) is arranged on a carrier (1, 10) and a silicon layer (3, 12) is arranged over the insulating layer. The silicon layer (3, 12) is structured, openings (L, LS) being formed down to the first insulating layers. An insulating layer region (IS, 13) and a planar further layer (P, 14) are applied. The further layer (P, 14) is structured, openings being formed down to the insulating layer region (IS, 13). The insulating layer region and the regions of the first insulating layer which are situated underneath it are selectively etched, and a covering layer is applied over the further layer as a planar covering (D). The device can be mounted in a plastic housing without a clean room atmosphere.

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