Method of forming cantilever structure in microelectromanical sy

Details Method of forming cantilever structure in microelectromanical sy Method of forming cantilever structure in microelectromanical sy

1998-03-10

2000-04-04

Chaudhuri, Olik

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438943, H01L 21306

Patent

active

060460660

ABSTRACT:
The present invention relates to a new process of the cantilever structure in the micro-electro-mechanical system (MEMS), and more particularly, to a process that could overcome the contamination problem on the undesired areas during the thin-film growth. Their advantages include not only to substitute the complex technique with sacrificial layer, but also to increase the yield for its simple structure and to deal the sub-micron microelectromechanical system technology for the mature stage on the wet-etching skill.

REFERENCES:
patent: 4071838 (1978-01-01), Block
patent: 4597003 (1986-06-01), Aine et al.
patent: 4670092 (1987-06-01), Motamedi

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