Submount of semiconductor laser diode, method of...

Details Submount of semiconductor laser diode, method of... Submount of semiconductor laser diode, method of...

2006-08-15

2006-08-15

Harvey, Minsun Oh (Department: 2828)

Coherent light generators

Particular active media

Semiconductor

C372S034000, C372S036000

Reexamination Certificate

active

07092420

ABSTRACT:
Provided is a submount flip-chip bonded to a semiconductor laser diode chip with stepped first and second electrodes. The submount includes a substrate having first and second surfaces which are separated by a step height corresponding to a height difference between the first and second electrodes; first and second metal layers being formed to the same thickness on the first and second surfaces, respectively; and first and second solder layers being formed to the same thickness on the first and second metal layers, respectively, and being bonded to the first and second electrodes, respectively.

REFERENCES:
patent: 6479325 (2002-11-01), Ozawa
patent: 2005/0194690 (2005-09-01), Ishii et al.

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