Semiconductor device and method of manufacturing the same,...

Details Semiconductor device and method of manufacturing the same,... Semiconductor device and method of manufacturing the same,...

2006-08-08

2006-08-08

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S778000, C257S787000, C257SE23129

Reexamination Certificate

active

07088007

ABSTRACT:
A semiconductor chip is adhered to a substrate by using an adhesive, and a sealant is provided around the semiconductor chip, on a surface of the substrate on which the semiconductor chip is mounted. The adhesive is provided to reach a side surface of the semiconductor chip. The sealant is provided in a manner to expose an upper surface of the semiconductor chip and a part of the adhesive.

REFERENCES:
patent: 6429372 (2002-08-01), Taguchi et al.

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