Abrading – Machine – Rotary tool
Reexamination Certificate
2006-08-15
2006-08-15
Nguyen, George (Department: 3723)
Abrading
Machine
Rotary tool
C451S285000, C451S286000, C451S288000, C451S289000
Reexamination Certificate
active
07090570
ABSTRACT:
A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.
REFERENCES:
patent: 5769699 (1998-06-01), Yu
patent: 5899745 (1999-05-01), Kim et al.
patent: 5964643 (1999-10-01), Birang et al.
patent: 5985090 (1999-11-01), Kikuta et al.
patent: 6093085 (2000-07-01), Yellitz et al.
patent: 6331137 (2001-12-01), Raeder et al.
patent: 6537133 (2003-03-01), Birang et al.
patent: 6544107 (2003-04-01), Misra et al.
patent: 6561873 (2003-05-01), Tsai et al.
patent: 6585579 (2003-07-01), Jensen et al.
patent: 6634936 (2003-10-01), Jensen et al.
Boo Jae Pil
Lim Young Sam
Yun Hyun Joo
Myers Bigel & Sibley Sajovec, PA
Nguyen George
Samsung Electronics Co,. Ltd.
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