Methods for modifying a vertical surface mount package

Details Methods for modifying a vertical surface mount package Methods for modifying a vertical surface mount package

2006-08-01

2006-08-01

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S827000, C029S832000, C029S842000, C029S739000, C029S740000, C083S929200, C083S942000, C174S260000

Reexamination Certificate

active

07082681

ABSTRACT:
A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. The stub contacts may be formed by trimming the leads of an existing vertical surface mount package. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.

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