Modeling process for integrated circuit film resistors

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

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C702S133000, C702S182000, C703S014000

Reexamination Certificate

active

07039888

ABSTRACT:
A method is presented, in which a thin film resistor is modeled to account for self-heating. The method includes fabricating the thin film resistor and characterizing a thermal resistance of the thin film resistor, wherein the thermal resistance accounts for self-heating thereof during operation. The thermal resistance is then used in a model for simulating integrated circuits using the thin film resistor.

REFERENCES:
patent: 6497824 (2002-12-01), Chen et al.
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