Ion doping device and method of cleaning ion doping system

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

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438905, 134 12, 134 42, 216 58, 216 67, 118715, 118716, 118723R, H01L 2100

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06033973&

ABSTRACT:
A halogen fluoride such as ClF.sub.3 is introduced into the chamber of the doping system. During the doping process, boron adhering to the inner wall of the chamber is changed into gaseous boron fluoride (such as BF.sub.3) and driven off.

REFERENCES:
patent: 4498953 (1985-02-01), Cook et al.
patent: 5563095 (1996-10-01), Frey

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