Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-11-07
2006-11-07
Johns, Andrew W. (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S147000, C382S149000, C382S141000, C348S087000, C348S126000, C356S237100
Reexamination Certificate
active
07133550
ABSTRACT:
A pattern inspection method in which an image can be detected without an image detection error caused by an adverse effect to be given by such factors as ions implanted in a wafer, pattern connection
on-connection, and pattern edge formation. A digital image of an object substrate is attained through microscopic observation thereof, the attained digital image is examined to detect defects, while masking a region pre-registered in terms of coordinates, or while masking a pattern meeting a pre-registered pattern, and an image of each of the defects thus detected is displayed. Further, each of the defects detected using the digital image attained through microscopic observation is checked to determine whether its feature meets a pre-registered feature or not. Defects having a feature that meets the pre-registered feature are so displayed that they can be turned on/off, or they are so displayed as to be distinguishable from the other defects.
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Hiroi Takashi
Kuni Asahiro
Miyai Hiroshi
Nara Yasuhiko
Shishido Chie
Antonelli, Terry Stout and Kraus, LLP.
Hitachi , Ltd.
Johns Andrew W.
Strege John B.
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