Method for isotropic etching of copper

Details Method for isotropic etching of copper Method for isotropic etching of copper

2006-06-06

2006-06-06

Barreca, Nicole (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C216S105000

Reexamination Certificate

active

07056648

ABSTRACT:
Copper and copper alloys are etched to provide uniform and smooth surface by employing an aqueous composition that comprises an oxidant, a mixture of at least one weak complexant and at least one strong complexant for the copper or copper alloy, and water and has a pH of about 6 to about 12 so as to form an oxidized etch controlling layer and to uniformly remove the copper or copper alloy; and then removing the oxidized etch controlling layer with a non-oxidizing composition. Copper and copper alloy structure, having smooth upper surfaces are also provided.

REFERENCES:
patent: 3809588 (1974-05-01), Zeblisky
patent: 4349411 (1982-09-01), Okinaka
patent: 6191085 (2001-02-01), Cooper et al.
patent: 6261953 (2001-07-01), Uozumi
patent: 6475909 (2002-11-01), Uozumi
patent: 6537381 (2003-03-01), Mikhaylich et al.
patent: 6787480 (2004-09-01), Aoki et al.

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