Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-08-01
2006-08-01
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S326000, C430S905000, C430S907000, C430S914000, C430S921000, C430S919000, C430S920000, C430S925000, C430S311000, C430S319000, C430S327000, C430S328000, C430S330000, C430S331000, C525S327700, C526S281000, C526S242000, C526S271000, C526S256000, C526S268000
Reexamination Certificate
active
07083893
ABSTRACT:
Photoresist polymers and photoresist compositions are disclosed. A photoresist polymer represented by Formula 1 and a photoresist composition containing the same have excellent etching resistance, thermal resistance and adhesive property, and high affinity to an developing solution, thereby improving LER (line edge roughness).wherein X1, X2, R1, R2, m, n, a, b and c are as defined in the description.
REFERENCES:
patent: 6455226 (2002-09-01), Lee et al.
patent: 2002/0172886 (2002-11-01), Momota et al.
patent: 2003/0235785 (2003-12-01), Barclay et al.
patent: 1164434 (2001-12-01), None
Hynix / Semiconductor Inc.
Lee Sin
Marshall & Gerstein & Borun LLP
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