Method for forming conductors in integrated circuits

Details Method for forming conductors in integrated circuits Method for forming conductors in integrated circuits

1997-05-15

1998-08-25

Niebling, John

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438647, 438645, 438648, 438688, 20419217, H01L 2128

Patent

active

057983003

ABSTRACT:
A method of forming electromigration resistant integrated circuit runners is disclosed. A collimated beam of particles is directed toward a substrate to form a metal nucleating layer. Then a non-collimated beam is used to form the rest of the metal layer. Then the layers are patterned to form runners.

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