Photosensitive resin composition and use of the same

Details Photosensitive resin composition and use of the same Photosensitive resin composition and use of the same

2006-03-07

2006-03-07

Ashton, Rosemary (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S283100, C430S330000, C522S034000, C522S050000

Reexamination Certificate

active

07008752

ABSTRACT:
A photosensitive resin composition which, when exposed to light through a photomask and then developed, can form a pattern comprising a polyimide film having a thickness of 20 μm or larger with high resolution; and a use of the composition, in particular, a method of forming a pattern comprising the polyimide film. The photosensitive resin composition comprises (a) a poly(amic acid), (b) a specific 1,4-dihydropyridine derivative, and (c) a specific imide acrylate compound.

REFERENCES:
patent: 49-011541 (1974-02-01), None
patent: 50-140922 (1975-11-01), None
patent: 54-145794 (1979-11-01), None
patent: 56-038038 (1981-04-01), None
patent: 06-075376 (1994-03-01), None
patent: 07-271034 (1995-10-01), None
patent: 07-281441 (1995-10-01), None
patent: 2002-148804 (2002-05-01), None

Affiliated with

Also associated with

Rating

Photosensitive resin composition and use of the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition and use of the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition and use of the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3606596