Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-03-07
2006-03-07
Parker, Kenneth (Department: 2815)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S654000, C438S653000, C438S687000, C257S758000
Reexamination Certificate
active
07008871
ABSTRACT:
Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating flows from the wafer edge inwards is provided.
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Andricacos Panayotis C.
Chen Shyng-Tsong
Cotte John M.
Deligianni Hariklia
Krishnan Mahadevaiyer
Chu Chris C.
Connolly Bove & Lodge & Hutz LLP
International Business Machines - Corporation
Parker Kenneth
Trepp Robert M.
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