Plating apparatus for plating a wafer

Details Plating apparatus for plating a wafer Plating apparatus for plating a wafer

1997-11-19

2000-03-07

Gorgos, Kathryn

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204224B, 204DIG7, 204290F, C25B 1100

Patent

active

060335408

ABSTRACT:
The present invention provides for a plating apparatus and a method of plating, which improve the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture can be provided at a center of a meshed anode electrode of the plating apparatus to obtain an electric field density distribution between the meshed anode electrode and a wafer that is lower in the central portion of the wafer than in the edge portion of the wafer.

REFERENCES:
patent: 4530742 (1985-07-01), Carlin et al.
patent: 4589969 (1986-05-01), Yurkov et al.
patent: 4797182 (1989-01-01), Beer et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5443707 (1995-08-01), Mori
patent: 5447615 (1995-07-01), Ishida

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