Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2006-03-28
2006-03-28
Hassanzadeh, Parviz (Department: 1763)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
Reexamination Certificate
active
07018550
ABSTRACT:
A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.
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Harris Richard D.
Knieser Michael J.
Kretschmann Robert J.
Lucak Mark A.
Culbert Roberts
Hassanzadeh Parviz
Rockwell Automation Technologies Inc.
Speroff R. Scott
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