Semiconductor etching process

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

252 791, 437129, 437234, H01L 21306, B44C 122

Patent

active

054198046

ABSTRACT:
A process for plasma etching a compound semiconductor heterostructure, e.g. to fabricate a ridge laser on a wavelength demultiplexer comprises anisotropic etching of the semiconductor by exposure to a plasma incorporating methane, hydrogen and oxygen. The oxygen content of the plasma is derived from a gaseous precursor such as carbon dioxide or nitrous oxide.

REFERENCES:
patent: 5068007 (1991-11-01), Rogers et al.

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