Method for fabricating bulbous-shaped vias

Details Method for fabricating bulbous-shaped vias Method for fabricating bulbous-shaped vias

2006-07-04

2006-07-04

Lebentritt, Michael S. (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S666000

Reexamination Certificate

active

07071088

ABSTRACT:
The present invention provides a method for fabricating bulbous-shaped vias on a substrate, having a surface, by disposing, on the substrate, a polymerizable fluid composition. A mold is placed in contact with the polymerizable fluid composition. The mold includes a relief structure on a surface thereof to create a recess in a layer of the polymerizable fluid composition. The polymerizable fluid composition is subjected to conditions to cause polymerization, forming a polymerized layer having a solidified indentation. An opening to the surface of the substrate is formed by removing material disposed on the substrate surface through etch processes. In a further embodiment a conductive layer may be disposed in the opening to form a gate. A lift-off process may be employed to remove the polymerized layer.

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