Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-04-11
2006-04-11
Zarabian, Amir (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S787000
Reexamination Certificate
active
07026710
ABSTRACT:
According to the present invention, a plastic land-grid array package, a plastic ball-grid package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by placing a sheet-like protector on the surface of the components during the molding phase, selectively encapsulating the bonding pads and coupling members of the chip while leaving empty space above the components, removing the protector and attaching a lid over the components. A molding method as well as a molding apparatus are provided compatible with the sensitivity of the micromechanical devices, yet flexible with regard to the technique used to assemble the chip and the substrate. Furthermore, the method disclosed is flexible with regard to the material and the properties of the substrate. The invention is applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In a key embodiment of the invention, the micromechanical components are micromirrors for a digital mirror device.
REFERENCES:
patent: 5061049 (1991-10-01), Hornbeck
patent: 5096279 (1992-03-01), Hornbeck et al.
patent: 5098626 (1992-03-01), Pas
patent: 5151276 (1992-09-01), Sato et al.
patent: 5280139 (1994-01-01), Suppelsa et al.
patent: 5293511 (1994-03-01), Poradish et al.
patent: 5331454 (1994-07-01), Hornbeck
patent: 5455456 (1995-10-01), Newman
patent: 5650915 (1997-07-01), Alfaro et al.
patent: 5684327 (1997-11-01), Nakazawa et al.
patent: 5729050 (1998-03-01), Kim
patent: 5897338 (1999-04-01), Kaldenberg
patent: 5904497 (1999-05-01), Akram
patent: 5917235 (1999-06-01), Imura
patent: 5936758 (1999-08-01), Fisher et al.
patent: 5939778 (1999-08-01), Boutin et al.
patent: 5939785 (1999-08-01), Klonis et al.
patent: 5955115 (1999-09-01), Bolanos et al.
patent: 6265766 (2001-07-01), Moden
patent: 6274927 (2001-08-01), Glenn
patent: 6291884 (2001-09-01), Glenn et al.
patent: 6309916 (2001-10-01), Crowley et al.
patent: 6429530 (2002-08-01), Chen
patent: 6441481 (2002-08-01), Karpman
patent: 6445077 (2002-09-01), Choi et al.
patent: 6489178 (2002-12-01), Coyle et al.
patent: 6528868 (2003-03-01), Weiblen et al.
patent: 6531334 (2003-03-01), Sasano
patent: 2001/0020743 (2001-09-01), Eldridge et al.
patent: 2002/0025607 (2002-02-01), Danno et al.
patent: 2003/0042625 (2003-03-01), Kurosawa et al.
patent: 2003/0045025 (2003-03-01), Coyle et al.
patent: 2003/0193086 (2003-10-01), Adachi et al.
patent: 0250146 (1987-09-01), None
patent: 354152970 (1979-12-01), None
patent: 403020350 (1991-01-01), None
Peter Van Zant, Microchip Fabrication, 2000, McGraw-Hill, pp. 578 and 579.
Bednarz George A.
Coyle Anthony L.
Brady III Wade James
Lewis Monica
Tung Yingsheng
Zarabian Amir
LandOfFree
Molded package for micromechanical devices and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Molded package for micromechanical devices and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molded package for micromechanical devices and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3579820