Semiconductor device and manufacturing method thereof

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S151000, C438S455000, C438S622000

Reexamination Certificate

active

07109071

ABSTRACT:
A method of realizing an active matrix display device having flexibility is provided. Further, a method for reducing parasitic capacitance between wirings formed on different layers is provided. After fixing a second substrate to a thin film device formed on a first substrate by bonding, the first substrate is removed, and wirings and the like are formed in the thin film device. The second substrate is removed next, and an active matrix display device having flexibility is formed. Further, parasitic capacitance can be reduced by forming wirings, after removing the first substrate, on the side in which a gate electrode over an active layer is not formed.

REFERENCES:
patent: 5166556 (1992-11-01), Hsu et al.
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5256562 (1993-10-01), Vu et al.
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5317236 (1994-05-01), Zavracky et al.
patent: 5331149 (1994-07-01), Spitzer et al.
patent: 5376561 (1994-12-01), Vu et al.
patent: 5376979 (1994-12-01), Zavracky et al.
patent: 5396304 (1995-03-01), Salerno et al.
patent: 5432461 (1995-07-01), Henley
patent: 5444557 (1995-08-01), Spitzer et al.
patent: 5467154 (1995-11-01), Gale et al.
patent: 5475514 (1995-12-01), Salerno et al.
patent: 5581385 (1996-12-01), Spitzer et al.
patent: 5612552 (1997-03-01), Owens
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5661371 (1997-08-01), Salerno et al.
patent: 5663777 (1997-09-01), Aoyama
patent: 5666175 (1997-09-01), Spitzer et al.
patent: 5692820 (1997-12-01), Gale et al.
patent: 5705424 (1998-01-01), Zavracky et al.
patent: 5743614 (1998-04-01), Salerno et al.
patent: 5751261 (1998-05-01), Zavracky et al.
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5766977 (1998-06-01), Yamazaki
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 5861929 (1999-01-01), Spitzer
patent: 5953595 (1999-09-01), Gosain et al.
patent: 6022792 (2000-02-01), Ishii et al.
patent: 6043800 (2000-03-01), Spitzer et al.
patent: 6072445 (2000-06-01), Spitzer et al.
patent: 6111626 (2000-08-01), Watanabe et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6317175 (2001-11-01), Salerno et al.
patent: 6320568 (2001-11-01), Zavracky
patent: 6423614 (2002-07-01), Doyle
patent: 6424020 (2002-07-01), Vu et al.
patent: 6500694 (2002-12-01), Enquist
patent: 6525415 (2003-02-01), Koyanagi et al.
patent: 6608654 (2003-08-01), Zavracky et al.
Australian Patent Office Communication—Search Report (Singapore Patent Application No. 200105539-1) dated Sep. 30, 2004; 4 pages.
Supplementary Search Report (Application No. 2001-05539-1; SG5208/5209D1) dated Sep. 30, 2004.

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