Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2006-04-18
2006-04-18
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S743000, C438S694000, C438S784000, C438S787000
Reexamination Certificate
active
07030045
ABSTRACT:
A method and system for forming a low defect oxide in a plasma processing chamber. By pulsing at least one of an RF power source and a processing gas, the growth of the oxide can be regulated. During periods in which the processing gas is not injected, an inert gas is injected to keep a substantially constant flow rate.
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Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Thai Luan
Tokyo Electron Limited
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