Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2006-05-23
2006-05-23
Whitehead, Jr., Carl (Department: 2813)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S250000, C174S258000
Reexamination Certificate
active
07049528
ABSTRACT:
A semiconductor chip mounting wiring board2includes an insulating resin substrate5,a first conductive bump12formed on one side of the insulative resin substrate5to mount a semiconductor chip3,a wiring pattern15extending from the first conductive bump12toward the periphery of the insulating resin substrate5,a filled viahole9leading from the other side of the insulating resin substrate5to the wiring pattern15,and a second conductive bump13,or a conductive pad19,positioned just above the filled viahole9and electrically connected to the viahole9.A semiconductor module is produced by mounting the semiconductor chip3in advance on the first conductive bump12on the semiconductor chip mounting wiring board2and stacking a plurality of the wiring boards2and interlayer members20each having an opening27to receive the semiconductor chip3and a conductive post26or conductive pad connected to the second conductive bump13of the wiring board2alternately on each other with an adhesive applied between them, placing another interconnecting circuit board such as an I/O wiring board30or the like on an outermost layer, and by applying hot-pressing to the stack. The semiconductor module thus produced has a high connection reliability and can be designed for a high mounting density and a lower profile.
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English Language Abstract of JP 10-256429.
English Language Abstract of JP 9-219490.
English Language Abstract of JP 10-135267.
English Language Abstract of JP 10-163414.
English Language Abstract of JP 2002-16169.
English Language Abstract of JP 2001-85603.
English Language Abstract of JP 2001-68624.
English Language Abstract of JP 2001-244365.
English Language Abstract of JP 2001-267490.
English Language Abstract of JP 2001-298115.
English Language Abstract of JP 2002-26244.
Kariya Takashi
Nishikawa Masaya
Doty Heather
Greenblum & Bernstein P.L.C.
Ibiden Co. Ltd.
Jr. Carl Whitehead
LandOfFree
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