Method for the removal of an imaging layer from a...

Details Method for the removal of an imaging layer from a... Method for the removal of an imaging layer from a...

2006-03-14

2006-03-14

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Removal of imaged layers

C430S322000, C134S001000

Reexamination Certificate

active

07011935

ABSTRACT:
Processes to overcome mistakes, such as, incorrect film thicknesses, poor coating quality, and incorrect feature dimensions made during the lithographic process in multilayer imaging systems are provided. To optimize manufacturing efficiency, it is desirable to be able to remove the top layer (an imaging layer) without having to remove, recoat, and usually cure the bottom layer (undercoat or underlayer). A rework process for removing an imaging layer from a substrate stack is such a process. The stack comprises a substrate, an underlayer adjacent to the substrate, and an imaging layer comprising silicon adjacent to the underlayer. The process comprises the steps of:(a) contacting the substrate stack with an imaging layer removal solvent;(b) removing the imaging layer with the imaging layer removal solvent thereby forming a substrate/underlayer stack, wherein the imaging layer removal solvent is selected from the group consisting of: glycol ethers, ketones, esters, lactates, dimethylsulfoxide (DMSO), dimethylformamide (DMF), tetrahydrofuran (THF), methyl tetrahydrofuran, dioxane, tetrahydropyran, ethyl tetrahydropyran-4-acetate, methyl tetrahydropyran-4-methanol, tetrahydropyran-4-one, n-butyl acetate, n-amyl acetate, and any combinations thereof; and(c) removing the imaging layer removal solvent from the substrate/underlayer stack after the imaging layer is removed.

REFERENCES:
patent: 5964951 (1999-10-01), Yamamoto et al.
patent: 6159646 (2000-12-01), Jeon et al.
patent: 6200724 (2001-03-01), Namiki et al.
patent: 2004/0076910 (2004-04-01), Rutter et al.

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