Method of making a semiconductor chip assembly with an...

Details Method of making a semiconductor chip assembly with an... Method of making a semiconductor chip assembly with an...

2006-03-21

2006-03-21

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S738000, C257S787000

Reexamination Certificate

active

07015128

ABSTRACT:
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip that includes a conductive pad to a routing line, mechanically attaching and electrically connecting a metal particle to the routing line, wherein the routing line extends laterally beyond the metal particle towards the chip and the chip and the metal particle extend vertically beyond the routing line in the same direction, forming an encapsulant after attaching the chip and the metal particle to the routing line wherein the chip and the metal particle are embedded in the encapsulant, and forming a connection joint that electrically connects the routing line and the pad.

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