Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2006-07-04
2006-07-04
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C438S517000
Reexamination Certificate
active
07071041
ABSTRACT:
There is provided a method of manufacturing a semiconductor device having a TFT with sufficient characteristics and little fluctuation by accurately controlling the addition amount of impurity ions to the semiconductor layer using an ion doping device. A semiconductor device having a TFT showing sufficient and stable characteristics may be obtained by increasing the ratio of the dopant amount in the doping gas and decreasing the ambient atmosphere components (C, N, O) and hydrogen to be simultaneously added with the impurity ions at the time of doping.
REFERENCES:
patent: 4727044 (1988-02-01), Yamazaki
patent: 4959700 (1990-09-01), Yamazaki
patent: 5064775 (1991-11-01), Chang
patent: 5104818 (1992-04-01), Silver
patent: 5132754 (1992-07-01), Serikawa et al.
patent: 5142344 (1992-08-01), Yamazaki
patent: 5247190 (1993-09-01), Friend et al.
patent: 5313077 (1994-05-01), Yamazaki
patent: 5315132 (1994-05-01), Yamazaki
patent: 5399502 (1995-03-01), Friend et al.
patent: 5514879 (1996-05-01), Yamazaki
patent: 5543636 (1996-08-01), Yamazaki
patent: 5614732 (1997-03-01), Yamazaki
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5859445 (1999-01-01), Yamazaki
patent: 5904509 (1999-05-01), Zhang et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 6011277 (2000-01-01), Yamazaki
patent: 6165876 (2000-12-01), Yamazaki et al.
patent: 6258638 (2001-07-01), Tanabe et al.
patent: 6353244 (2002-03-01), Yamazaki et al.
patent: 6455360 (2002-09-01), Miyasaka
patent: 07-130652 (1995-05-01), None
patent: 10-092576 (1998-04-01), None
patent: 10-302707 (1998-11-01), None
patent: 90-13148 (1990-11-01), None
Wolf et al., “Silicon Processing for the VLSI Era vol. 1: Process Technology”, pp. 323-325, 1986, Lattice Press.
Hermann Schenk et al., Polymers for Light Emitting Diodes, The 19thInternational Display Research Conference Proceedings, Sep. 6-9, 1999, Berlin, Germany pp. 33-37.
Ohnuma Hideto
Ohtani Hisashi
Yamazaki Shunpei
Booth Richard A.
Costellia Jeffrey L.
Nixon Peabody
Semiconductor Energy Laboratory Co,. Ltd.
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