Semiconductor device containing a dummy wire

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

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C257S758000, C257S635000, C257S762000, C257S763000, C257S764000, C257S775000, C257S700000, C257S701000, C257S751000, C257S767000, C257S776000, C257S306000, C257S295000, C257S296000, C257S752000

Reexamination Certificate

active

07042099

ABSTRACT:
There is disclosed a semiconductor device comprising a substrate, a first insulating film which is provided above the substrate and has a relative dielectric constant which is at most a predetermined value, a second insulating film which is provided on a surface of the first insulating film and has a relative dielectric constant greater than the predetermined value, a wire which is provided in a recess for the wire, which is formed passing through the second insulating film and extending into the first insulating film, and a dummy wire provided in a recess for the dummy wire, which is formed passing through the second insulating film and extending into the first insulating film, and is located in a predetermined area spaced from an area where the wire is provided.

REFERENCES:
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patent: 6037668 (2000-03-01), Cave et al.
patent: 6432811 (2002-08-01), Wong
patent: 6767826 (2004-07-01), Abe
patent: 6815787 (2004-11-01), Yaung et al.
patent: 6849549 (2005-02-01), Chiou et al.
patent: 6858936 (2005-02-01), Minamihaba et al.
patent: 2002/0132468 (2002-09-01), Wong
patent: 2004/0101663 (2004-05-01), Agarwala et al.
patent: 2004/0121577 (2004-06-01), Yu et al.
patent: 2004/0140564 (2004-07-01), Lee et al.
patent: 2004/0155278 (2004-08-01), Natori et al.
patent: 2001-168093 (2001-06-01), None
patent: 2001-196372 (2001-07-01), None

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