Method for making a semiconductor die package

Details Method for making a semiconductor die package Method for making a semiconductor die package

2006-04-04

2006-04-04

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S107000, C438S611000, C438S612000

Reexamination Certificate

active

07022548

ABSTRACT:
A method for processing a semiconductor substrate is disclosed. The method includes providing a mask having an aperture on a semiconductor substrate having a conductive region. An aperture in the mask is disposed over the conductive region. A pre-formed conductive column is placed in the aperture and is bonded to the conductive region.

REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3429040 (1969-02-01), Miller
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4980753 (1990-12-01), Dunaway et al.
patent: 5092036 (1992-03-01), Hu et al.
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 5288944 (1994-02-01), Bronson et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5346857 (1994-09-01), Scharr et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5359768 (1994-11-01), Haley
patent: 5515604 (1996-05-01), Horine et al.
patent: 5536362 (1996-07-01), Love et al.
patent: 5567657 (1996-10-01), Wojnarowski et al.
patent: 5636104 (1997-06-01), Oh
patent: 5639696 (1997-06-01), Liang et al.
patent: 5641990 (1997-06-01), Chiu
patent: 5678287 (1997-10-01), Smith et al.
patent: 5710062 (1998-01-01), Sawai et al.
patent: 5847929 (1998-12-01), Bernier et al.
patent: 6013571 (2000-01-01), Morrell
patent: 6060769 (2000-05-01), Wark
patent: 6133634 (2000-10-01), Joshi
patent: 6201679 (2001-03-01), Richiuso
patent: 6251707 (2001-06-01), Bernier et al.
patent: 6294406 (2001-09-01), Bertin et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6339191 (2002-01-01), Crane, Jr. et al.
patent: 6346469 (2002-02-01), Greer
patent: 6372553 (2002-04-01), Briar
patent: 6391687 (2002-05-01), Cabahug et al.
patent: 6429533 (2002-08-01), Li et al.
patent: 6541710 (2003-04-01), Deeney et al.
patent: 6847118 (2005-01-01), Milewski et al.
patent: 2002/0005591 (2002-01-01), Lin
patent: 2002/0070842 (2002-06-01), Heaney
patent: 2002/0100973 (2002-08-01), Akram et al.
patent: 309651 (1997-10-01), None

Affiliated with

Also associated with

Rating

Method for making a semiconductor die package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making a semiconductor die package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a semiconductor die package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3561961