Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-07-04
2006-07-04
Mai, Anh Duy (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21575
Reexamination Certificate
active
07071092
ABSTRACT:
An embodiment of the invention is an integrated circuit2having antenna proximity lines3coupled to the semiconductor substrate5. Another embodiment of the invention is a method of manufacturing an integrated circuit2having antenna proximity lines3coupled to the semiconductor substrate5.
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patent: 2002/0074589 (2002-06-01), Benaissa et al.
Krishnan Anand T.
Krishnan Srikanth
Brady III W. James
Duy Mai Anh
Keagy Rose Alyssa
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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