Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-03-28
2006-03-28
Lebentritt, Michael (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S698000
Reexamination Certificate
active
07019404
ABSTRACT:
A multi-layered circuit substrate for a semiconductor device comprises a multi-layered circuit substrate body having first and second surfaces and comprising a plurality of conductive pattern layers integrally laminated one on the other from the first surface to the second surface, so that a plurality of semiconductor device elements can be arranged on the first surface of the substrate body; and a plate member, a rigidity thereof being higher than that of the substrate body, attached to the second surface of the substrate body. A plurality of semiconductor elements can be mounted on the semiconductor element mounting surface defined on the first surface of the substrate body.
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Iijima Takahiro
Rokugawa Akio
Lebentritt Michael
Shinko Electric Industries Co. Ltd.
Stevenson Andre′
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