Package for integrated circuit die

Details Package for integrated circuit die Package for integrated circuit die

2006-05-02

2006-05-02

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S666000, C257S691000, C257S692000, C257S698000, C257S784000, C257S712000, C257S713000, C438S123000, C438S617000

Reexamination Certificate

active

07038305

ABSTRACT:
An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a die mounted substantially in the center of the die attach pad such that the die is encompassed by the hollowed out center. The package further includes a single-piece drop-in heat sink having a first and second disk shaped portions where the first disk shaped portion has a diameter that is different than the second disk shaped portion.

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