Package type semiconductor device

Details Package type semiconductor device Package type semiconductor device

2006-03-07

2006-03-07

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S720000, C257S328000, C257S330000, C257S178000

Reexamination Certificate

active

07009292

ABSTRACT:
A package type semiconductor device comprising: a semiconductor chip having a semiconductor part; a main electrode for connecting to a first region of the semiconductor part; a control wiring layer for connecting to a second region of the semiconductor part; a blocking member electrically isolated from the control wiring layer; a first metallic layer; a protection film disposed among the main electrode, the control wiring layer and the blocking member; and a metal block for connecting to the main electrode through the first metallic layer. The chip, the main electrode, the control wiring layer, the blocking member, and the metal block are packaged. The blocking member is disposed between the main electrode and the control wiring layer.

REFERENCES:
patent: 5831291 (1998-11-01), Evans et al.
patent: 6703707 (2004-03-01), Mamitsu et al.
patent: 6803667 (2004-10-01), Okura et al.
patent: 08222732 (1996-08-01), None
patent: 2003133329 (2003-05-01), None

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