Method of fabricating semiconductor device and semiconductor...

Details Method of fabricating semiconductor device and semiconductor... Method of fabricating semiconductor device and semiconductor...

2006-05-23

2006-05-23

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S109000, C257S774000, C257S775000

Reexamination Certificate

active

07049229

ABSTRACT:
An insulating film having openings larger than viaholes, formed as being aligned with the viaholes, is coated on the back surface of a silicon semiconductor substrate so that the viaholes fall within the openings, a conductive film is then formed so as to fill the viaholes and the openings by plating, vacuum evaporation or a technique using a metal paste, and the conductive film is then cut using a bite to thereby form through electrodes.

REFERENCES:
patent: 5496755 (1996-03-01), Bayraktaroglu
patent: 5903058 (1999-05-01), Akram
patent: 6110825 (2000-08-01), Mastromatteo et al.
patent: 6225651 (2001-05-01), Billon
patent: 6294837 (2001-09-01), Akram et al.
patent: 6303469 (2001-10-01), Larson et al.
patent: 6319751 (2001-11-01), Lin
patent: 6624500 (2003-09-01), Takafuji
patent: 6627824 (2003-09-01), Lin
patent: 6716657 (2004-04-01), Soh
patent: 6841883 (2005-01-01), Farnworth et al.
patent: 62-072161 (1987-04-01), None
patent: 05-029483 (1993-02-01), None
patent: 2003-078080 (2003-03-01), None

Affiliated with

Also associated with

Rating

Method of fabricating semiconductor device and semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating semiconductor device and semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating semiconductor device and semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3550647