Heat dissipation system for semiconductor device

Details Heat dissipation system for semiconductor device Heat dissipation system for semiconductor device

2006-04-25

2006-04-25

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S760000, C257S659000

Reexamination Certificate

active

07035106

ABSTRACT:
A heat dissipation system for a semiconductor device having a plurality of semiconductor chips, includes a heat dissipation member which cools the semiconductor chips, an exterior heat dissipation member which is provided opposite to the heat dissipation member, engaged to the semiconductor device and connected to an electrical ground, an electric conductor member which is provided between the heat dissipation member and the exterior heat dissipation member, and electrically connects the heat dissipation member and the exterior heat dissipation member to each other, and a thermal conductivity insulating member which is inserted between the heat dissipation member and the exterior heat dissipation member. Accordingly, the resistance against common mode noise is increased. Furthermore, the heat dissipation efficiency of the semiconductor device is also increased. The head dissipation system improves the heat dissipation efficiency of the semiconductor device to control noise.

REFERENCES:
patent: 5459348 (1995-10-01), Smith
patent: 5640045 (1997-06-01), Krausse, III
patent: 6075700 (2000-06-01), Houghton et al.
patent: 6226183 (2001-05-01), Weber et al.
patent: 6509629 (2003-01-01), Yoshimatsu et al.
patent: 6522555 (2003-02-01), Hirano et al.
patent: 6853559 (2005-02-01), Panella et al.
patent: 9-153590 (1997-06-01), None
patent: 9-312376 (1997-12-01), None
patent: 2000-295839 (2000-10-01), None
patent: 2002-158317 (2002-05-01), None
patent: 2002-51468 (2002-06-01), None

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