Slotted adhesive for die-attach in BOC and LOC packages

Details Slotted adhesive for die-attach in BOC and LOC packages Slotted adhesive for die-attach in BOC and LOC packages

2006-05-30

2006-05-30

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S736000, C174S259000, C257S753000, C257S774000

Reexamination Certificate

active

07054161

ABSTRACT:
A method and apparatus for attaching an integrated circuit die to a leadframe or substrate. More specifically, a patterned adhesive material is used to attach an integrated circuit die to a leadframe in an LOC package, or a substrate in a BOC package. The patterned adhesive may be a tape or any other suitable material for attaching an I/C to a substrate or leadframe. The adhesive patterns may be configured to form strips of adhesive material or may be a solid piece of material with apertures cut therethrough.

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patent: 361056434 (1986-03-01), None

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