Polishing pad for chemical mechanical polishing apparatus

Details Polishing pad for chemical mechanical polishing apparatus Polishing pad for chemical mechanical polishing apparatus

2006-05-30

2006-05-30

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S533000, C451S527000

Reexamination Certificate

active

07052368

ABSTRACT:
Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.

REFERENCES:
patent: 6280290 (2001-08-01), Birang et al.
patent: 6358130 (2002-03-01), Freeman et al.
patent: 6454630 (2002-09-01), Tolles
patent: 6524164 (2003-02-01), Tolles
patent: 6716085 (2004-04-01), Wiswesser et al.
patent: 2002-36097 (2002-02-01), None
patent: 1020020082555 (2002-10-01), None
English language abstract of Korean Publication No. 1020020082555.
English language abstract of Japanese Publication No. 2002-36097.

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