Method and system for drying semiconductor wafers in a spin...

Details Method and system for drying semiconductor wafers in a spin... Method and system for drying semiconductor wafers in a spin...

2006-01-31

2006-01-31

Lindsay, Jr., Walter L. (Department: 2812)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S906000

Reexamination Certificate

active

06992023

ABSTRACT:
The invention provides methods and apparatus for drying the backside of semiconductor wafers in a spin-coating environment. Solvent is evaporatively dried from a semiconductor wafer held in a spin mechanism. The undried wafer is sprayed with one or more jets of pressurized gas from gas ports disposed about the spin mechanism.

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