Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2006-03-14
2006-03-14
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192120, C204S192170, C204S298060, C204S298110, C204S298160, C204S298260
Reexamination Certificate
active
07011733
ABSTRACT:
In a sputtering apparatus, target particles to be deposited onto a substrate are selectively ionized relative to other particles in the deposition chamber. For example, titanium or titanium-containing target particles are selectively ionized, while inert particles, such as argon atoms, remain substantially unaffected. Advantageously, one or more optical ionizers, such as lasers, are used to create one or more ionization zones within the deposition chamber in which such selective ionization takes place.
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Shiraishi translation. JP 05-311419.
Fletcher Yoder PC
McDonald Rodney G.
Micro)n Technology, Inc.
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