Sputtering device

Details Sputtering device Sputtering device

2006-03-07

2006-03-07

VerSteeg, Steven (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298200, C204S298260, C204S298280

Reexamination Certificate

active

07008520

ABSTRACT:
An object of the invention is to provide a sputtering device which can provide increased distribution of film formation and coverage distribution better than prior sputtering devices. Thus, this invention is that, in the sputtering device constituted of a substrate holder for holding a substrate, at least one target for forming a thin film on the substrate, at least one sputtering cathode which has the target and magnets arranged behind the substrate, an axis of the target is inclined to an axis of the sputtering cathode, and the sputtering cathode is rotated on its axis to make the target swing relative to the substrate.

REFERENCES:
patent: 6042706 (2000-03-01), Fu
patent: 6533906 (2003-03-01), Kawakubo et al.

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