Method to couple integrated circuit packages to bonding pads...

Details Method to couple integrated circuit packages to bonding pads... Method to couple integrated circuit packages to bonding pads...

2006-03-07

2006-03-07

Beausoliel, Robert (Department: 2113)

Error detection/correction and fault detection/recovery

Data processing system error or fault handling

Reliability and availability

C713S002000

Reexamination Certificate

active

07010723

ABSTRACT:
An improved method of testing a computer system comprises a sequence of tests that are performed when the computer system is first turned on, according to one embodiment. The operation of various components of the computer system, such as a chipset, a random access memory, a cache memory, a video controller, a keyboard controller, peripheral memory controllers, busses, and the like, is tested by a test program stored in read only memory (ROM). If the components successfully pass, an address is permanently changed in ROM, so that the test sequence is bypassed whenever the computer system is subsequently booted, saving significant time during future reboots. An improved computer system and a machine-accessible medium are also described.

REFERENCES:
patent: 5872967 (1999-02-01), DeRoo et al.
patent: 5978913 (1999-11-01), Broyles et al.
patent: 5987625 (1999-11-01), Wolff
patent: 6014744 (2000-01-01), McKaughan et al.
patent: 6216226 (2001-04-01), Agha et al.
patent: 6640316 (2003-10-01), Martin et al.
patent: 6718461 (2004-04-01), Ewertz
patent: 6721885 (2004-04-01), Freeman et al.
patent: 6732299 (2004-05-01), Mbarki
patent: 6754817 (2004-06-01), Khatri et al.
patent: 2002/0162052 (2002-10-01), Lewis
patent: 2002/0184483 (2002-12-01), Morrison et al.
Microsoft; Simple Boot Flag Specification Overview; http//www.microsoft.com/whdc/resources/respec/specs/simp—bios.mspx; Updated Feb. 7, 2002. (Copy Enclosed).

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