Silicon carbide semiconductor structures including multiple...

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S105000, C257S628000, C257S930000, C257SE21054, C257SE21699

Reexamination Certificate

active

07109521

ABSTRACT:
An epitaxial silicon carbide layer is fabricated by forming first features in a surface of a silicon carbide substrate having an off-axis orientation toward a crystallographic direction. The first features include at least one sidewall that is orientated nonparallel (i.e., oblique or perpendicular) to the crystallographic direction. A first epitaxial silicon carbide layer is then grown on the surface of the silicon carbide substrate that includes first features therein. Second features are then formed in the first epitaxial layer. The second features include at least one sidewall that is oriented nonparallel to the crystallographic direction. A second epitaxial silicon carbide layer is then grown on the surface of the first epitaxial silicon carbide layer that includes the second features therein.

REFERENCES:
patent: 4865685 (1989-09-01), Palmour
patent: 4912063 (1990-03-01), Davis et al.
patent: 4912064 (1990-03-01), Kong et al.
patent: 4981551 (1991-01-01), Palmour
patent: 5227034 (1993-07-01), Stein et al.
patent: 5571374 (1996-11-01), Thero et al.
patent: 5679153 (1997-10-01), Dmitriev et al.
patent: 6034001 (2000-03-01), Shor et al.
patent: 6297522 (2001-10-01), Kordina et al.
patent: 6452228 (2002-09-01), Okuno et al.
patent: 6569250 (2003-05-01), Paisley et al.
patent: 6853006 (2005-02-01), Kataoka et al.
patent: 2003/0042538 (2003-03-01), Kumar et al.
patent: 2003/0079689 (2003-05-01), Sumakeris et al.
patent: 2003/0080842 (2003-05-01), Sumakeris et al.
patent: 2003/0188687 (2003-10-01), Paisley et al.
patent: 2004/0183079 (2004-09-01), Kaneko et al.
patent: 103 34 819 (2004-02-01), None
Sumakeris et al.,Methods and Apparatus for Controlling Formation of Deposits in a Deposition System and Deposition Systems and Methods Including the Same,U.S. Appl. No. 10/414,787, filed Apr. 16, 2003.
Sumakeris,Method to Reduce Stacking Fault Nucleation Sites and Reduce Forward Voltage Drift in Bipolar Devices,U.S. Appl. No. 10/605,312, filed Sep. 22, 2003.
“Notification of Transmittal of The International Search Report and the Written Opinion of the International Searching Authority, or the Declaration”, “Written Opinion of the International Searching Authority” and “International Search Report”, PCT/US2005/004480, Oct. 7, 2005.
“Notification of Transmittal of The International Search Report and the Written Opinion of the International Searching Authority, or the Declaration”, “Written Opinion of the International Searching Authority” and “International Search Report”, PCT/US2005/004473, May 10, 2005.
Nikolaev et al., “SiC liquid-phase epitaxy on patterned substrates”,Journal of Crystal Growth,166:607-611 (1996).
Nordell et al., “Equilibrium crystal shapes for 6H and 4H SiC grown on non-planar substrates”,Materials Science and Engineering,B61-62:130-134 (1999).
Nordell et al., “Homoepitaxy of 6H and 4H SiC on nonplanar substrates”,Appl. Phys. Lett.,72(2):197-199 (1998).
Richter et al., “Rapid plasma etching of cubit SiC using NF3/ O2gas mixtures”,Materials Science and Engineering,B46:160-163 (1997).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Silicon carbide semiconductor structures including multiple... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicon carbide semiconductor structures including multiple..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon carbide semiconductor structures including multiple... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3527204

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.